Edith Cowan University Copyright Warning

At present, as we enter the nanD and giga·scaled integrated-circuit era, there are many systna design challenges which must be overcome to resolve problems ill current systems. The incredibly increased Ilollrecllrring engineering (NRE) cost, abruptly shortelled Time­ to-Market (ITA) period and ever widening design productive gaps are good examples illllstrating the problems ill clfrrelil systems. To cope with these problems, the concept of an Adaptive Computlilg System is becomillg a critical technology for next generation computing s;'stems. The other hig problem is all explosion ill the interconnection wire requiremell1s ill standard planar technology resulting from the very high data-bandwidtll requirements demallded for real-time commullications and multimedia signal processing. TIle concept of 3D-vertical i1!legratioll of 2D planar chips becomes an attractive solution to combat the ever increasing illlercollllect wire requirements. As a result, this research proposes tile concept of a llove13D integrated adaptive computing system, which we term 3D-ACSoC. The architecture and advanced system design methodology of the proposed 3D-SojtChip as a forthcoming giga-scaled integrated circuit compllling system has been introduced, along with high-level system modeJing andfimctional verifi�!!!irm ill the early design stage using Systemc. A major challenge in this research is to explore the proposed 3D-SoftChip platform to investigate the effectiveness of the first novel 3D vertically integrated Adaptive Computing System-oil-Chip (ACSoC) as a next generation computing system. The suggested 3D-SoftChip has been modeled at a system level using SystemC alld tile functional verification of the modeled system has been firmly verified. The hand-crafted assembler code for imp/emelllation of the MPEG4 motion estimation algorithm has been applied with m(}re than 3.8 times perfonnance improvement over conventional systems. It call be clearly demonstrated that it is a highly suitable architecture for 1Z�Xt generation computing systems. Finally, further work to realize the full impieme1llation of the novel concept of a 3D-ACSoC has been suggested.